Until very recently, technology for semiconductors has been a dedicated follower of Moore’s law, raising the level of integration continuously. The width of lines in the first integrated circuits was about 10 µm (1/100 mm); it is now possible to process at the level of 14 nm. New transistor structures present a three-dimensional aspect, making it increasingly unclear what it actually refers to when speaking of the 14 nm Semiconductor Process.
History
So, 14 nm hasn’t been an easy road. Intel, generally regarded as the most prominent company in chip making, never introduced its 14 nm processors into the high-volume manufacturing for several years, while rival companies like Samsung Electronics started launching 14 nm chips as early as 2014.
Gradually, the technology evolved into several versions:
- Original 14 nm technology
- 14 nm +, increasing drive current by 12%, lower power consumption
- 14 nm ++ strength, providing higher drive-current by 23% and less 52% power consumption from original
All these are improvements in performance and power efficiency, thus longer battery life for devices using those chips.
Advantages
There were very much impactful improvements given by the introduction of 14 nm.
Improved Energy Efficiency: Power leakage is very low, and switching speeds are much better, showing better performance per watt.
Cost-effectiveness: While there are very high initial costs of research and development, this technology is better area-scalable and will probably spend less on a per-unit basis in the longer term.
Better Performance: It has much taller and thinner fins that provide higher drive current and overall performance improvement.
More Density: Smaller transistors will mean much more of them can be packed in a single chip, offering more powerful processors.
Challenges
Yield Problems: Achieving consistent, high-quality output at such a scale proves to be extremely challenging.
Design Complexities: Designers create highly efficient and powerful designs at this scale, relying on very high-end Electronic Design Automation tools.
Lithography Limitations: Engineers use advanced techniques, such as multiple patterning, to achieve the required resolution at this technology node.
Power Dissipation: There are increasing problems that arise to address the heat and power associated with these components as they shrink.
Material Sensitivities: Manufacturing ultra-small components increases the likelihood of damage.
Testing Challenges: Engineers must apply advanced testing methodologies to detect defects in such small components.
Security Concerns: The growing availability of IoT devices makes securing these tiny, connected processors increasingly important.
Scope Beyond
Although there are manufacturers who now use very small process node technologies such as 10 nm, 7 nm, and 5 nm, there is still relevance to 14 nm technology. Its maturity and cost-effectiveness make this technology a favorable option for many uses. As the industry tends to push physics further and further, we expect to see more refinements for 14 nm technology along with the coming of age of a more advanced process.
14 nm Semiconductor Process is in mass production just in time. It was the first 14nm chips, but data show that they have really good causes to be optimistic regarding their process. The feature size and leakage improvements are in line with previous generation process nodes, which should bode well for chances next year as it attempts to break into the market for high performance mobile.
